JEDEC JESD22-A104F Standard

JEDEC JESD22-A104F is a temperature cycling test standard issued by the American Electronics Industry Alliance (JEDEC), mainly used to evaluate the reliability and stability of electronic components under extreme temperature changes. 

This standard is applicable to single-chamber, double-chamber and triple-chamber temperature cycling tests conducted in air or other gas media, covering component and solder joint tests. In a single-chamber cycle, the load is placed in a stationary chamber, and the load is heated or cooled by introducing hot or cold air into the chamber. In a double-chamber cycle, the load is placed on a moving platform and moves between two stationary chambers maintained at a constant temperature. In a triple-chamber temperature cycle, there are three chambers, and the load moves between them. (This standard does not cover rapid heating rates of thermal shock conditions typically associated with heat shock test chambers using thermal energy liquid coupling media.)

This test is designed to determine the ability of components and solder joints to withstand mechanical stress in alternating extreme high and low temperatures. These mechanical stresses may cause permanent changes in electrical and/or physical properties.